Qualcomm Plans to Bring Data Center HBC Chip Architecture to Smartphones for Enhanced On-Device AI

According to Qualcomm Executive Vice President Durga Maladi, on June 27, Qualcomm plans to introduce its high-bandwidth computing (HBC) architecture from data centers to smartphones to enhance on-device AI capabilities. The newly unveiled HBC architecture employs chip vertical stacking design with tightly integrated memory and computing units, significantly improving data transmission speed and efficiency. The first-generation data center version will launch next year, with commercial availability expected in 2028. Qualcomm is currently in discussions with smartphone, personal computer, and automotive manufacturers regarding the technology.
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