Samsung Considers Building Advanced Semiconductor Packaging Plant in South Korea, to Announce June 29

Samsung Electronics is considering building an advanced semiconductor packaging facility in Gwangju, South Korea, to meet global chip demand, according to reports. The company is expanding its presence in the HBM market as part of broader efforts to strengthen its position in the AI chip supply chain. Samsung is expected to announce its investment plan during a June 29 meeting between South Korea's president and business leaders.
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