NVIDIA Pushes PCB Supply Chain Upstream; HVLP4 Copper Foil Shortage Forecast Over 40% in 2026

According to Odaily, NVIDIA and its key customers are directly coordinating upstream material supplies to ensure large-scale production of next-generation AI servers. The company is bypassing CCL manufacturers and engaging directly with material suppliers to manage glass fiber cloth and copper foil inventory, locking in critical material capacity over a year in advance through direct consignment models.

HVLP4 copper foil is emerging as the primary supply bottleneck. Analyst jukan at Citrini projects a supply shortage exceeding 40% in 2026, with a 1,500-ton deficit expected starting the second half, and a 25% shortfall continuing into 2027 as demand shifts from HVLP2/HVLP3 to HVLP4 for advanced AI servers and high-performance computing platforms.